Auropent^® A

With the onburnable special alloy Auropent® A you have a safe and stable alloy for crowns and bridges of middle span for the sensible patient at your disposal, which has proven itself excellent for the biocybernetic use.

Assembly in procentual weight:

Gold 87,30 • Platinum 9,90 • Rhodium 0,50 • Silver 0,50 • Zinc 1,50 • Iron 0,30

yellow • extra strong • Free of palladium, indium, iridium, cadmium, beryllium and copper

DIN EN ISO 22674 • CE 1275

Auropent^® AH

With this onburnable universal alloy you have THE universal alloy of first choice at your disposal. Because of the high precious metal share of more than 96 percent and its harmonic stable alloy-structure Auropent® AH is one of the most corrosive resistent universal alloy ever. The metalion-emisson in corrosiontests after DIN 1662 lies with 6.2 micrograms far under the demanded borderline amount of 100. The released ions are exclusively essential trace elements! Its excellent heat durability and its outstanding mechanical abilities result out of its high Vickers toughness of 240 and the very high stress limit of 600! Auropent® AH has established itself for more than 8 years at the dental market.

Assembly in procentual weight:

Gold 77,0 • Platinum 19,0 • Rhodium 0,3 • Silver 1,6 • Zinc 1,8 • Iron 0,3

yellow • extra strong • free of palladium, indium, iridium, cadmium, beryllium and copper

DIN EN ISO 22674 • CE 1275

Auropent^® B

With this not onburnable universal alloy Auropent® B you have got another universal alloy at your disposal with the same excellent abilities.

Assembly in procentual weight:

Gold 80,0 • Platinum 4,5 • Silver 8,7 • Copper 5,8 • Zinc 1,0

Yellow • extra strong • free of palladium, indium, iridium, cadmium and beryllium.

DIN EN ISO 22674 • CE 1275

Auropent^® I

This alloy is a special inlay alloy, which can be cemented actively inside the oral cavity after the Tucker process.

Assembly in procentual weight:

Gold 80,0 • Platinum 2,0 • Silver 10,5 • Copper 7,0 • Zinc 0,5

Yellow • middle strong • free of palladium, indium, iridium, cadmium and beryllium

DIN EN ISO 22674 • CE 1275

Solders

The solders of the Auropent^® ABI system are corrosive resistant and contain no further component than the alloys themselves.

Auropent^® solder 740 °C • Gold 75,0 • Silver 10,3 • Copper3,5 • Zinc 11,2

Auropent^® solder 830 °C • Gold 75,0 • Silver 11,0 • Copper 10,0 • Zinc 4,0

Auropent^® solder 1010 °C • Gold 64,5 • Silver 34,5 • Zinc 1,0

Laser wires

Together with the orthodentisic wires the laser wires round up the Auropent^® ABI system.

Auropent^® KFO - wire

for the orthodentistic use with

• Bionator
• Crozat

Before the bending the wire must be soft annealed for 5 minutes at 750°C and afterwards chilled in water.

After the bending and before the polymerication the wire must be heat-treated at 500°C for 15 minutes.